What’s next: SGP.42 and the “born connected” device
SGP.42 is a new specification currently under development that will enable in-factory profile provisioning (IFPP). This means manufacturers will be able to install bootstrap profiles from the factory floor, allowing eSIM devices – both IoT and consumer – to connect immediately once deployed. Then, once in the field, SGP.32 can be used to download and activate the most appropriate profile based on local network conditions, if necessary.
On the surface, IFPP may seem like an incremental feature. After all, if devices can already be provisioned remotely, why do it in the factory? In fact, IFPP addresses a significant pain point when it comes to low-power headless devices.
The process of remotely authenticating, downloading, and activating new eSIM profiles onto low-power devices, such as smart meters or environmental sensors, is a significant drain on battery power – often shortening a device’s lifespan by several years.
When scaled across fleets of thousands of units deployed all over the world, the cost of such power inefficiencies can quickly add up – both financially and environmentally. Provisioning eSIM profiles on the factory floor with SGP.42 can help mitigate this and thus help maximize the longevity of devices in the field.
Other benefits of IFPP include the following:
- Streamlined manufacturing: with a single SKU, manufacturers can bulk-produce devices for global deployment, removing the need to produce different versions for different regional and connectivity requirements.
- Faster, zero-touch deployment: once shipped from the factory, devices arrive pre-provisioned and can connect immediately, reducing setup time and manual configuration.
- Lower provisioning cost and complexity: setting up connectivity earlier in the life cycle simplifies operations for manufacturers, operators, and enterprises alike.
It’s important to note that SGP.42 will not replace SGP.32. Instead, the two specifications are designed to work together, complementing each other across different stages of the device life cycle. IFPP takes care of connectivity at the point of manufacture, while RSP provides the flexibility needed to manage connectivity throughout a device’s operational life.
SGP.42 is also still under development. The architecture and requirements for IFPP (SGP.41) were first published in February 2025, but the full technical specification (SGP.42) is not expected to be finalized until Q3 2026. Until then, SGP.32 will continue to mature – no doubt bringing plenty of fresh challenges as new use cases emerge.
Keeping on top of these developments is a whole challenge in itself. It’s one thing to ensure compliance with new standards, but it’s another to continuously adapt as they evolve. Whether you’re a device manufacturer, MNO, or enterprise scaling IoT deployments, partnering with an expert can eliminate much of this complexity and accelerate adoption.
As a global connectivity leader, G+D is well-positioned to support IoT players in this journey, not only with its modular suite of IoT and eSIM solutions, but also as a GSMA partner with an active role in shaping the standards themselves.